The Assembly division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, has developed ALPHA EF-8800HF wave solder flux as a solution to resolve assembly problems in the wave soldering process for thick, high density PCBs.
Reliability and component miniaturization concerns have resulted in the use of thicker PCBs in many processes. These boards have created electronic assembly challenges such as bridging, solder balling, achieving complete hole fill, pin testing accuracy and difficulty in meeting halogen-free process goals. ALPHA EF-8800HF wave solder flux was created to help minimize these challenges and result in higher levels of process throughput and PCB reliability.
“ALPHA EF-8800HF performs particularly well on thicker PCBs in terms of electrical reliability,” said Bernice Chung, Global Portfolio Manager for Wave Solder Assembly Solutions. “It was developed for spray fluxing applications, for both standard and low Ag SAC alloys, and has demonstrated stable performance even under long exposure to higher preheat and solder pot temperatures.”
ALPHA EF-8800HF is a halogen-free, mid solids, alcohol based, no clean wave soldering flux that provides superior hole-fill, pin testing and solder ball performance while delivering excellent lead-free solder joint cosmetics with evenly spread, tack-free residue. In looking specifically at halogen-free chemistries, MacDermid Alpha discovered the resulting residues have increased reliability in terms of SIR (Surface Insulation Resistance) and ECM (Electrochemical Migration) versus similar products that contain halogens or halides. This is significant considering the many challenges in assembling denser electronic assemblies and meeting high reliability requirements.
Post time: Dec-03-2019